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Journal of Electronic Packaging
J Electron Packag

Published/Hosted by The American Society of Mechanical Engineers. ISSN (printed): 1043-7398. ISSN (electronic): 1528-9044.

This journal publishes papers that use experimental and theoretical (analytical and coputer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic, optoelectronics, and photonics components, devices, and systems. Originally, practicality, high engineering level, and mechanical (materials) orientation are the major criteria for the acceptance of a submitted paper.

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