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Genamics JournalSeek
Circuit World
Circ World
ISSN: 0305-6120.
Circuit World provides a central, authoritative, international and independent forum for the exchange of information pertaining to the standard, design, analysis, materials, process, reliability and manufacturing of substrates for the first level packages such as ball grid array (BGA), chip scale package (CSP), flip chip, and multichip module (MCM) and printed circuit board (PCB) for the second-level assembly of the BGA modules, MCM and direct chip attach (DCA).
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